서울국제포럼 The Seoul Forum for International Affairs(SFIA)

Dr. Joungho Kim received B.S. and M.S. degrees in electrical engineering from Seoul National University, Seoul, Korea, in 1984 and 1986, respectively, and Ph.D degree in electrical engineering from the University of Michigan, Ann Arbor, in 1993. In 1994, he joined Memory Division of Samsung Electronics, where he was engaged in Gbit-scale DRAM design. In 1996, he moved to KAIST (Korea Advanced Institute of Science and Technology). He is currently professor at electrical engineering department of KAIST.

Since joining KAIST, his research centers on EMC modeling, design, and measurement methodologies of 3D IC, TSV, Interposer, System-in-Package, multi-layer PCB, and wireless power transfer (WPT) technologies. Especially, his major research topic is focused on chip-package-PCB co-design and co-simulation for signal integrity, power integrity, ground integrity, timing integrity, and radiated emission in 3D IC, TSV and Interposer. He has authored and co-authored over 588 technical papers published at refereed journals and conference proceedings. Also, he has given more than 267 invited talks and tutorials at the academia and the related industries. He is currently the director of Samsung-KAIST industrial Collaboration Center.

He published a book, “Electrical Design of Through Silicon Via,” by Springer in 2014. Dr. Joungho Kim was Conference chair of IEEE EDAPS 2015 in Seoul, and Joint conference chair of Japan-Korea Microwave society in 2015. He also was the conference chair of IEEE WPTC (Wireless Power Transfer Conference) 2014, held in Jeju Island, Korea. And he was the symposium chair of IEEE EDAPS Symposium 2008, and was the TPC chair of APEMC 2011. He is also an associated editor of the IEEE Transactions of Electromagnetic Compatibility. He served as a guest editor of the special issue in the IEEE Transactions of Electromagnetic Compatibility for PCB level signal integrity, power integrity, and EMI/EMC in 2010, and as a guest editor of the special issue in the IEEE Transactions of Advanced Packaging for TSV (Through-Silicon-Via) in 2011. He served as a guest editor of the mini-special issue in the IEEE Transactions of Microwave Theory and Techniques, for IEEE WPTC in 2015. He received Outstanding Academic Achievement Faculty Award of KAIST in 2006, KAIST Grand Research Award in 2008, National 100 Best Project Award in 2009, KAIST International Collaboration Award in 2010, KAIST Grand Research Award in 2014, and Teaching Award in 2015, respectively. He was appointed as an IEEE EMC society distinguished lecturer in a period from 2009-2011. He received Technology Achievement Award from IEEE Electromagnetic Society in 2010. He is IEEE fellow.

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